Lecture Notes on Principles of Plasma Processing

Book w. online files / update

von

Chen, Francis F.Chang, Jane P.

BuchKartoniert, Paperback

208 Seiten

Englisch

Springer Netherlandserschienen am31.01.2003

Plasma processing of semiconductors is an interdisciplinary field requiring knowledge of both plasma physics and chemical engineering. Basic plasma concepts are introduced painlessly to those who have studied undergraduate electromagnetics but have had no previous exposure to plasmas.mehr

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KlappentextPlasma processing of semiconductors is an interdisciplinary field requiring knowledge of both plasma physics and chemical engineering. Basic plasma concepts are introduced painlessly to those who have studied undergraduate electromagnetics but have had no previous exposure to plasmas.

Details

ISBN/GTIN978-0-306-47497-2

ProduktartBuch

EinbandartKartoniert, Paperback

Verlag

Springer Netherlands

Erscheinungsjahr2003

Erscheinungsdatum31.01.2003

Seiten208 Seiten

SpracheEnglisch

Gewicht582 g

IllustrationenXI, 208 p. 177 illus. With online files/update.

Artikel-Nr.11513206

Rubriken

GenreNaturwissenschaft/Umwelt/Technik

Inhalt/Kritik

Inhaltsverzeichnis

Al: Introduction to Plasma Science.- I. What is a plasma?.- II. Plasma fundamentals.- A2: Introduction to Gas Discharges.- III. Gas discharge fundamentals.- A3: Plasma Sources I.- IV. Introduction to plasma sources.- A4: Plasma Sources II.- V. RIE discharges.- A5: Plasma Sources III.- VI. ECR sources.- VII. Inductively coupled plasmas (ICPs).- A6: Plasma Sources IV.- VIII. Helicon wave sources and HDPs.- IX. Discharge equilibrium.- A7: Plasma Diagnostics.- X. Introduction.- XI. Remote diagnostics.- XII. Langmuir probes.- XIII. Other local diagnostics.- Bl: Overview of Plasma Processing in Microelectronics Fabrication.- I. Plasma processing.- II. Applications in Microelectronics.- B2: Kinetic Theory and Collisions.- I. Kinetic theory.- II. Practical gas kinetic models and macroscopic properties.- III. Collision dynamics.- B3: Atomic Collisions and Spectra.- I. Atomic energy levels.- II. Atomic collisions.- III. Elastic collisions.- IV. Inelastic collisions.- B4: Molecular Collisions and Spectra.- I. Molecular energy levels.- II. Selection rule for optical emission of molecules.- III. Electron collisions with molecules.- IV. Heavy particle collisions.- V. Gas phase kinetics.- B5: Plasma Diagnostics.- I. Optical emission spectroscopy.- II. Laser induced fluorescence.- III. Laser interferometry.- IV. Full-wafer interferometry.- V. Mass spectrometry.- B6: Plasma Surface Kinetics.- I. Plasma chemistry.- II. Surface reactions.- III. Loading.- IV. Selectivity.- V. Detailed reaction modeling.- B7: Feature Evolution and Modeling.- I. Fundamentals of feature evolution in plasma etching.- II. Predictive modeling.- III. Mechanisms of profile evolution.- IV. Profile simulation.- V. Plasma damage.- Epilogue: Current Problems in Semiconductor Processing.- I. Front-end challenges.- 1. High-k dielectrics.- 2. Metal gates.- II. Back-end challenges.- 1. Copper metalllization.- 2. Interlayer dielectrics (ILDs).- 3. Barrier materials.- III. Patterning nanometer features.- 1. E-beam.- 2. Resist trimming.- IV. Deep reactive etch for MEMS.- V. Plasma-induced damage.- VI. Species control in plasma reactors.mehr