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Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)

BuchGebunden
904 Seiten
Englisch
Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years.mehr
EUR1.156,50

Produkt

KlappentextThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years.
Details
ISBN/GTIN978-981-323-966-1
ProduktartBuch
EinbandartGebunden
FormatGenäht
Erscheinungsjahr2018
Erscheinungsdatum30.07.2018
Seiten904 Seiten
SpracheEnglisch
MasseBreite 173 mm, Höhe 254 mm, Dicke 56 mm
Gewicht2223 g
Artikel-Nr.47523691

Inhalt/Kritik

Inhaltsverzeichnis
Volume 1: Heat Transfer in Avionic Equipment (Boris Abramzon):Using Cold Plates and Compact Heat Exchangers for Cooling of Electronics Equipment; Heat Transfer and Flow Friction Data for Circular and Noncircular Ducts; Heat Transfer and Hydraulic Performance Data of Compact Heat Transfer Surfaces for Avionics Cooling; Flow Pressure Drop Analysis, Fans, and Pumps; Thermal Conduction Heat Transfer in Finned Passages; Mathematical Model of Heat Transfer in Cold Plates; Analysis of Compact Fin-Plate Heat Exchangers with e-NTU Method; Rating, Sizing and Optimum Design Problems of Compact Fin-Plate Heat Exchangers; Random Optimization Search Algorithm MARS; Air Physical Properties; Physical Properties of Liquid coolants and Construction Materials; Volume 2: Thermal Management of RF Systems (John D Albrecht, David H Altman & Joseph J Maurer):Introduction to Thermal Management of Advanced Radar Systems; Thermal Management Fundamentals; Past and Current Thermal Solutions for Electronically Scanned Arrays; Thermal Management in AESA Systems Engineering; Advancements in Thermal Technology for Remote Cooling Architectures; Towards Embedded Thermal Architectures; Volume 3: Phase Change Materials for Thermal Management of Electronic Components (Gennady Ziskind & Yoram Kozak):Introduction to Phase-Change Materials; Overview of Phase-Change Materials; Modeling Approaches; Experimental Methods; Basic Geometries and Processes; Heat Sinks; Enhanced Systems; PCM Slurries; Case Studies;mehr