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Dependable Embedded Systems

BuchGebunden
608 Seiten
Englisch
Springererschienen am10.12.20201st ed. 2021
Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches).mehr

Produkt

KlappentextUnlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches).
Details
ISBN/GTIN978-3-030-52016-8
ProduktartBuch
EinbandartGebunden
Verlag
Erscheinungsjahr2020
Erscheinungsdatum10.12.2020
Auflage1st ed. 2021
ReiheEmbedded Systems
Seiten608 Seiten
SpracheEnglisch
Gewicht1081 g
IllustrationenXIII, 608 p. 293 illus., 250 illus. in color.
Artikel-Nr.48572028

Inhalt/Kritik

Inhaltsverzeichnis
Introduction.- Design of efficient, dependable SoCs based on cross-layer-reliability approach with emphasis on wireless communication as application and DRAM memories.- CRAU: Compositional System-Level Reliability Analysis in the Presence of Uncertainties.- Semantics-aware Soft Error Handling for Embedded Systems using Compiler-OS Interaction.- ARES: Self-Adaptive Coarse-Grained Reconfigurable Architectures as Reliability Enhancers in Embedded Systems.- Cross-Layer Techniques for Dependable Software Execution on Embedded Systems.- Ambrosia: Cross-layer Modeling and Mitigation of Aging Effects in Embedded Systems.- Cross-Layer Dependability for Embedded Hardware/Software Systems.- Fault-Tolerant Computing with Heterogeneous Hardware/Software Hardening Modes.- Robust Computing for Machine Learning-Based Systems.- Hardening embedded system software.- LIFT: Lifting Device-Level Characteristics for Error Resilient System Level Design: A Crosslayer Approach.- VirTherm-3D: Communication Virtualization Enabling System Management for Dependable 3D MPSoCs.- OTERA: Online Test Strategies for Reliable Reconfigurable Architectures.- Variability-Aware Software: Recent Results and Contributions.- EM Lifetime Constrained Optimization for Multi-Segment Power Grid Networks.- Lightweight Software-Assisted Memory Error Correction.- Reliability-Driven Resource Management for Multi-Core Systems-on-Chip.- Monitor Circuits for Device-Circuit Interaction.- PERCIES: Providing Efficient Reliability in Critical Embedded Systems.mehr

Schlagworte

Autor

Prof. Jörg Henkel is with Karlsruhe Institute of Technology (KIT), Germany, where he is directing the Chair for Embedded Systems CES. Before, he was a Senior Research Staff Member at NEC Laboratories in Princeton, NJ. He received his PhD from Braunschweig University with "Summa cum Laude". Prof. Henkel has/is organizing various embedded systems and low power ACM/IEEE conferences/symposia as General Chair and Program Chair and was a Guest Editor on these topics in various Journals like the IEEE Computer Magazine. He was Program Chair of CODES'01, RSP'02, ISLPED'06, SIPS'08, CASES'09, Estimedia'11, VLSI Design'12, ICCAD'12, PATMOS'13, NOCS'14 and served as General Chair for CODES'02, ISLPED'09, Estimedia'12, ICCAD'13 and ESWeek'16. He is/has been a steering committee member of major conferences in the embedded systems field like at ICCAD, ESWeek, ISLPED, Codes+ISSS, CASES and is/has been an editorial board member of various journals like the IEEE TVLSI, IEEE TCAD, IEEE TMSCS, ACM TCPS, JOLPE etc.
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